17969187. REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Theron Lee Lewis of Rochester MN (US)

Timothy P. Younger of Rochester MN (US)

David J. Braun of St. Charles MN (US)

John R. Dangler of Rochester MN (US)

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 17969187 titled 'REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

Simplified Explanation

The abstract describes a method for forming an electronic device by solder bonding pins from a component to plated through holes of a board.

  • Solder paste is applied to openings of the plated through holes on the opposite side of the board where the component is positioned.
  • The solder paste is drawn to the pins to provide a reworked solder bond, bonding at least one of the pins to the plated through hole.

Potential Applications

This technology can be applied in the manufacturing of various electronic devices such as circuit boards, sensors, and other electronic components.

Problems Solved

This method solves the problem of securely bonding pins from a component to a board, ensuring a reliable connection for electronic devices.

Benefits

The method provides a strong and reliable solder bond between pins and plated through holes, improving the overall performance and longevity of electronic devices.

Potential Commercial Applications

This technology can be utilized in industries such as electronics manufacturing, telecommunications, automotive, and consumer electronics for the production of high-quality electronic devices.

Possible Prior Art

One possible prior art could be the use of traditional soldering techniques for bonding pins to plated through holes in electronic devices.

Unanswered Questions

How does this method compare to traditional soldering techniques for bonding pins to plated through holes in terms of reliability and efficiency?

This article does not provide a direct comparison between this method and traditional soldering techniques in terms of reliability and efficiency. Further research or testing may be needed to determine the advantages of this method over traditional techniques.

What are the potential challenges or limitations of implementing this method in large-scale electronic device manufacturing processes?

The article does not address the potential challenges or limitations of implementing this method in large-scale electronic device manufacturing processes. Factors such as cost, scalability, and compatibility with existing manufacturing equipment could be important considerations that need to be explored further.


Original Abstract Submitted

A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.