17963281. SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract (International Business Machines Corporation)

SKIP VIA WITH LATERAL LINE CONNECTION

Organization Name

International Business Machines Corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Koichi Motoyama of Clifton Park NY (US)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

SKIP VIA WITH LATERAL LINE CONNECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17963281 titled 'SKIP VIA WITH LATERAL LINE CONNECTION

Simplified Explanation

The semiconductor structure described in the abstract includes multiple levels of interconnect wiring and a skip via that extends from the third level of interconnect wiring to the first level, maintaining electrical contact with the second level. The contact area between the skip via and the second level of interconnect wiring is greater than the contact area between the skip via and the first level of interconnect wiring.

• The semiconductor structure includes:
  • First level of interconnect wiring
  • Second level of interconnect wiring above the first level
  • Third level of interconnect wiring above the second level
  • Skip via extending from the third level to the first level, maintaining contact with the second level

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1. 1. 1. Potential Applications

• This technology can be used in the manufacturing of advanced semiconductor devices.
• It can improve the efficiency and performance of integrated circuits.

1. 1. 1. Problems Solved

• This technology helps in achieving better electrical contact between different levels of interconnect wiring.
• It addresses the challenge of maintaining contact in complex semiconductor structures.

1. 1. 1. Benefits

• Enhanced electrical connectivity between different levels of interconnect wiring.
• Improved reliability and performance of semiconductor devices.

1. 1. 1. Potential Commercial Applications
         1. Enhancing Semiconductor Interconnects for Improved Performance

• This technology can be utilized by semiconductor manufacturers to enhance the performance of their products.
• It can lead to the development of more advanced and efficient integrated circuits.

1. 1. 1. Possible Prior Art

• Prior art related to multi-level interconnect structures in semiconductor devices.
• Previous innovations in via structures for improving electrical connectivity in integrated circuits.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this technology impact the overall size of the semiconductor device?

The abstract does not provide information on whether this technology affects the size of the semiconductor structure. It would be interesting to know if the skip via design has any implications on the overall dimensions of the device.

1. 1. 1. 1. What are the potential challenges in implementing this technology in mass production?

The abstract does not discuss any challenges that may arise during the mass production of semiconductor structures using this technology. Understanding the practical implications and hurdles faced in large-scale manufacturing would provide valuable insights.

Original Abstract Submitted

A semiconductor structure is presented including a first level of interconnect wiring, a second level of interconnect wiring disposed above the first level of interconnect wiring, a third level of interconnect wiring disposed above the second level of interconnect wiring, and a skip via extending from the third level of interconnect wiring to the first level of interconnect wiring such that a sidewall of the skip via maintains electrical contact with the second level of interconnect wiring. A contact area between the sidewall of the skip via and the second level of interconnect wiring is greater than a contact area between a bottom portion of the skip via and a top portion of the first level of interconnect wiring.