17962434. ISOLATING HEAT SPREADER simplified abstract (International Business Machines Corporation)

ISOLATING HEAT SPREADER

Organization Name

International Business Machines Corporation

Inventor(s)

Keiji Matsumoto of Yokohama-shi (JP)

Mukta Ghate Farooq of HOPEWELL JCT NY (US)

John Knickerbocker of Monroe NY (US)

ISOLATING HEAT SPREADER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17962434 titled 'ISOLATING HEAT SPREADER

Simplified Explanation

The abstract describes a heat spreader apparatus with a first portion, a second portion, and a connecting portion between them. The apparatus has high-conductivity axes and a low-conductivity axis, with the low-conductivity axis directed between the first and second portions. The first, second, and connecting portions are thermally anisotropic blocks, forming a rectangular prism.

• High-conductivity axes and low-conductivity axis in the heat spreader apparatus
• Thermally anisotropic blocks used for the first, second, and connecting portions

Potential Applications

The heat spreader apparatus can be used in electronic devices, such as computers, smartphones, and servers, to efficiently dissipate heat and prevent overheating.

Problems Solved

1. Overheating in electronic devices due to poor heat dissipation. 2. Uneven distribution of heat within electronic components.

Benefits

1. Improved thermal management in electronic devices. 2. Increased longevity and performance of electronic components. 3. Enhanced reliability of electronic devices.

Potential Commercial Applications

"Thermal Management Solutions for Electronic Devices"

Possible Prior Art

Prior art may include other heat spreader designs using different materials or configurations to achieve thermal conductivity and dissipation.

How does the heat spreader apparatus compare to traditional heat sink designs in terms of efficiency and cost-effectiveness?

The article does not provide a direct comparison between the heat spreader apparatus and traditional heat sink designs.

What specific electronic devices or industries could benefit the most from implementing this heat spreader technology?

The article does not specify which electronic devices or industries could benefit the most from using this heat spreader technology.

Original Abstract Submitted

A heat spreader apparatus includes a first portion; a second portion; and a connecting portion between the first and second portions, with high-conductivity axes and a low-conductivity axis, the low-conductivity axis being directed between the first and second portions. In one or more embodiments, the first, second, and connecting portions are thermally anisotropic blocks, and the apparatus forms a rectangular prism.