17958813. ANTENNA MODULE AND RADIO FREQUENCY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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ANTENNA MODULE AND RADIO FREQUENCY APPARATUS INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Dooseok Choi of Hwaseong-si (KR)

Youngki Lee of Suwon-si (KR)

Sunwoo Lee of Suncheon-si (KR)

Thomas Byunghak Cho of Seongnam-si (KR)

ANTENNA MODULE AND RADIO FREQUENCY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17958813 titled 'ANTENNA MODULE AND RADIO FREQUENCY APPARATUS INCLUDING THE SAME

Simplified Explanation

The abstract describes a radio frequency (RF) apparatus that includes a radio frequency integrated circuit (RFIC) chip and an antenna module. The antenna module consists of two antenna patches, one parallel to the RFIC chip and the other above it. The first antenna patch has a first penetration point and a first power feed point connected to a first power feed line for transmitting and receiving a first RF signal of a first frequency band. The second antenna patch has a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is located in a specific region of the first antenna patch to minimize the influence on the electric field generated by the first antenna patch via the first power feed point.

  • The RF apparatus includes an RFIC chip and an antenna module.
  • The antenna module consists of two antenna patches.
  • The first antenna patch is parallel to the RFIC chip and has a first penetration point.
  • The first antenna patch also has a first power feed point connected to a first power feed line for transmitting and receiving a first RF signal of a first frequency band.
  • The second antenna patch is located above the first antenna patch and is parallel to it.
  • The second antenna patch has a second power feed point connected to a second power feed line that penetrates through the first penetration point.
  • The second antenna patch is used to transmit and receive a second RF signal of a second frequency band.
  • The first penetration point is positioned in a specific region of the first antenna patch to minimize the influence on the electric field generated by the first antenna patch via the first power feed point.

Potential Applications

  • Wireless communication devices
  • Internet of Things (IoT) devices
  • Mobile phones
  • Wi-Fi routers
  • Bluetooth devices

Problems Solved

  • Efficient transmission and reception of RF signals in multiple frequency bands
  • Minimization of interference between different RF signals
  • Compact design for integration into small devices

Benefits

  • Improved performance of wireless communication devices
  • Enhanced signal reception and transmission capabilities
  • Compact and space-saving design for integration into various devices
  • Minimized interference between different RF signals


Original Abstract Submitted

A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.