17957983. THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Scott William Jessen of Allen TX (US)
Steven Lee Prins of Fairview TX (US)
Sameer Prakash Pendharkar of Allen TX (US)
Gregory Boyd Shinn of Dallas TX (US)
THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17957983 titled 'THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE
Simplified Explanation
The abstract of the patent application describes a passive circuit component with low line edge roughness (LER) achieved through a self-aligned double patterning (SADP) etch process using a tri-layer process flow.
- The passive circuit component includes an edge with low line edge roughness (LER).
- The method for manufacturing the passive circuit component involves a self-aligned double patterning (SADP) etch process using a tri-layer process flow.
- The tri-layer process flow consists of an underlayer, hard mask, and photoresist.
- The passive circuit component made using this method reduces mismatch between like components due to the low LER.
Potential Applications
The technology can be applied in the manufacturing of high-frequency passive components, such as filters and couplers, for communication systems and electronic devices.
Problems Solved
1. Improved matching between like components due to low line edge roughness. 2. Enhanced performance and reliability of passive circuit components.
Benefits
1. Higher precision and accuracy in manufacturing passive circuit components. 2. Increased efficiency in communication systems and electronic devices. 3. Improved signal quality and reduced signal loss.
Potential Commercial Applications
Optimizing passive circuit components for use in telecommunications equipment, radar systems, and high-speed data transmission devices.
Possible Prior Art
Previous methods for manufacturing passive circuit components may not have addressed the issue of line edge roughness and its impact on component matching and performance.
Unanswered Questions
How does the low line edge roughness affect the overall performance of the passive circuit component?
The article does not delve into the specific impact of low line edge roughness on the functionality and efficiency of the passive circuit component.
What are the specific parameters and tolerances for achieving low line edge roughness in the manufacturing process?
The article does not provide detailed information on the exact parameters and tolerances required to achieve the desired low line edge roughness in the manufacturing process.
Original Abstract Submitted
A passive circuit component includes an edge having a low line edge roughness (LER). A method for manufacturing the passive circuit component includes a self-aligned double patterning (SADP) etch process using a tri-layer process flow. The tri-layer process flow includes use of an underlayer, hard mask, and photoresist. The passive circuit component made by this method achieves improved mismatch between like components due to the low LER.
