17957761. SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract (Intel Corporation)
Contents
- 1 SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
Organization Name
Inventor(s)
Phil Geng of Washougal WA (US)
Carlos Alberto Lizalde Moreno of Guadalajara (MX)
Raul Enriquez Shibayama of Zapopan (MX)
Steven A. Klein of Chanlder AZ (US)
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17957761 titled 'SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
Simplified Explanation
The patent application describes a socket interconnect apparatus that includes a housing with multiple openings, a ground structure coupled to the housing, ground pins, and signal pins.
- The housing has first and second openings, while the ground structure has third openings that align with the second openings when coupled to the housing.
- Ground pins are located in the second and third openings to electrically couple them, while signal pins are located in the first openings and are electrically isolated from the ground structure.
Potential Applications
The technology described in the patent application could be used in various electronic devices that require socket interconnect structures, such as computer motherboards, networking equipment, and telecommunications devices.
Problems Solved
This technology solves the problem of providing a reliable and efficient socket interconnect structure that allows for the electrical coupling of ground pins while keeping signal pins electrically isolated.
Benefits
The benefits of this technology include improved signal integrity, reduced interference, and enhanced overall performance of electronic devices that utilize socket interconnect structures.
Potential Commercial Applications
The technology could be commercialized for use in the manufacturing of electronic components, devices, and systems where socket interconnect structures are required. A potential SEO-optimized title for this section could be "Commercial Applications of Socket Interconnect Structures."
Possible Prior Art
One possible prior art for this technology could be existing socket interconnect structures used in electronic devices, although the specific design and features described in the patent application may offer unique improvements and advantages.
Unanswered Questions
How does the ground structure ensure proper alignment with the housing openings?
The patent application does not provide detailed information on the specific mechanisms or features that enable the ground structure to align accurately with the housing openings.
Are there any alternative materials or configurations for the ground and signal pins?
The patent application does not discuss potential variations in materials or configurations for the ground and signal pins that could affect the performance or functionality of the socket interconnect apparatus.
Original Abstract Submitted
Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.
