17956821. CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE simplified abstract (ADVANCED MICRO DEVICES, INC.)
Contents
- 1 CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the controller determine the appropriate TEC power level based on the activity level of the processor?
- 1.11 What are the potential limitations or challenges of implementing this cooling system in different types of electronic devices?
- 1.12 Original Abstract Submitted
CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE
Organization Name
Inventor(s)
MICHAEL J. Austin of AUSTIN TX (US)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
SUKESH Shenoy of AUSTIN TX (US)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956821 titled 'CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE
Simplified Explanation
The apparatus described in the patent application is a cooling system for components, specifically a thermoelectric cooling (TEC) device coupled to a processor. The system includes a controller that receives data on the activity level of the processor and adjusts the power provided to the TEC device accordingly.
- The apparatus includes a thermoelectric cooling (TEC) device and a controller.
- The controller receives data on the activity level of the processor.
- Based on this data, the controller determines the appropriate power level for the TEC device.
- The power provided to the TEC device is then adjusted accordingly.
Potential Applications
The technology described in this patent application could be applied in various electronic devices, such as computers, servers, and other systems with processors that require cooling to maintain optimal performance.
Problems Solved
This technology addresses the issue of overheating in electronic devices, which can lead to decreased performance and potential damage to components. By dynamically adjusting the cooling power based on the activity level of the processor, the system can effectively manage temperature levels and prevent overheating.
Benefits
The benefits of this technology include improved performance and longevity of electronic devices, as well as energy efficiency by only using the necessary cooling power. Additionally, the system can provide a more stable operating environment for processors, leading to better overall reliability.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of high-performance computers and servers, where efficient cooling systems are crucial for maintaining optimal performance. Another application could be in the development of advanced cooling solutions for electronic devices in various industries.
Possible Prior Art
One possible prior art for this technology could be existing cooling systems for electronic devices that use sensors to monitor temperature levels and adjust cooling power accordingly. However, the specific implementation of using a TEC device coupled to a processor and dynamically adjusting the cooling power based on the processor's activity level may be a novel approach.
Unanswered Questions
How does the controller determine the appropriate TEC power level based on the activity level of the processor?
The patent application does not provide detailed information on the specific algorithms or methods used by the controller to determine the TEC power level. Further details on this process would be beneficial for understanding the technical aspects of the technology.
What are the potential limitations or challenges of implementing this cooling system in different types of electronic devices?
The patent application does not discuss any potential limitations or challenges that may arise when implementing this cooling system in various electronic devices. Understanding these factors could provide insights into the practical applications and scalability of the technology.
Original Abstract Submitted
An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.