View source for 17956802. SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING simplified abstract (ADVANCED MICRO DEVICES, INC.)

=SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING=


==Organization Name==

[[:Category:ADVANCED MICRO DEVICES, INC.|ADVANCED MICRO DEVICES, INC.]]


[[Category:ADVANCED MICRO DEVICES, INC.]]

==Inventor(s)==

[[:Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)|CHRISTOPHER M. Jaggers of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)]]

[[:Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)|CHRISTOPHER M. Helberg of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)]]

==SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17956802 titled 'SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING

==Simplified Explanation==

The apparatus described in the patent application is designed to sub-cool components using a combination of a component cooling device, a processor, an electronic component, a fan, and a thermoelectric cooling device. The thermoelectric cooling device is responsible for cooling the airflow from a higher temperature to a lower temperature.

* Component cooling device
* Processor thermally coupled to the component cooling device
* Electronic component
* Fan directing airflow across the processor and electronic component
* Thermoelectric cooling device cooling the airflow from a first temperature to a second temperature

== Potential Applications ==
The technology described in the patent application could be applied in various industries such as:
* Electronics manufacturing
* Data centers
* Automotive industry

== Problems Solved ==
This technology helps in addressing the following issues:
* Overheating of components
* Ensuring optimal performance of electronic devices
* Improving overall efficiency

== Benefits ==
The benefits of this technology include:
* Enhanced cooling capabilities
* Increased lifespan of components
* Improved reliability and performance

== Potential Commercial Applications ==
The potential commercial applications of this technology could include:
* Manufacturing and selling cooling systems for electronic devices
* Licensing the technology to companies in need of efficient cooling solutions

== Possible Prior Art ==
One possible prior art for this technology could be the use of traditional cooling methods such as fans and heat sinks in electronic devices.

=== Unanswered Questions ===

== How does the thermoelectric cooling device compare to traditional cooling methods in terms of efficiency and effectiveness? ==
The article does not provide a direct comparison between the thermoelectric cooling device and traditional cooling methods. Further research and testing would be needed to determine the advantages and disadvantages of each approach.

== Are there any limitations or drawbacks to using a thermoelectric cooling device in this context? ==
The article does not mention any potential limitations or drawbacks of using a thermoelectric cooling device for sub-cooling components. It would be important to investigate factors such as cost, maintenance requirements, and scalability to fully understand the implications of implementing this technology.


==Original Abstract Submitted==

An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. The thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.



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