17956802. SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING simplified abstract (ADVANCED MICRO DEVICES, INC.)
Contents
- 1 SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the thermoelectric cooling device compare to traditional cooling methods in terms of efficiency and effectiveness?
- 1.11 Are there any limitations or drawbacks to using a thermoelectric cooling device in this context?
- 1.12 Original Abstract Submitted
SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
Organization Name
Inventor(s)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956802 titled 'SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
Simplified Explanation
The apparatus described in the patent application is designed to sub-cool components using a combination of a component cooling device, a processor, an electronic component, a fan, and a thermoelectric cooling device. The thermoelectric cooling device is responsible for cooling the airflow from a higher temperature to a lower temperature.
- Component cooling device
- Processor thermally coupled to the component cooling device
- Electronic component
- Fan directing airflow across the processor and electronic component
- Thermoelectric cooling device cooling the airflow from a first temperature to a second temperature
Potential Applications
The technology described in the patent application could be applied in various industries such as:
- Electronics manufacturing
- Data centers
- Automotive industry
Problems Solved
This technology helps in addressing the following issues:
- Overheating of components
- Ensuring optimal performance of electronic devices
- Improving overall efficiency
Benefits
The benefits of this technology include:
- Enhanced cooling capabilities
- Increased lifespan of components
- Improved reliability and performance
Potential Commercial Applications
The potential commercial applications of this technology could include:
- Manufacturing and selling cooling systems for electronic devices
- Licensing the technology to companies in need of efficient cooling solutions
Possible Prior Art
One possible prior art for this technology could be the use of traditional cooling methods such as fans and heat sinks in electronic devices.
Unanswered Questions
How does the thermoelectric cooling device compare to traditional cooling methods in terms of efficiency and effectiveness?
The article does not provide a direct comparison between the thermoelectric cooling device and traditional cooling methods. Further research and testing would be needed to determine the advantages and disadvantages of each approach.
Are there any limitations or drawbacks to using a thermoelectric cooling device in this context?
The article does not mention any potential limitations or drawbacks of using a thermoelectric cooling device for sub-cooling components. It would be important to investigate factors such as cost, maintenance requirements, and scalability to fully understand the implications of implementing this technology.
Original Abstract Submitted
An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. The thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.
