17956799. COMPONENT COOLER FOR A COMPUTING DEVICE simplified abstract (ADVANCED MICRO DEVICES, INC.)

COMPONENT COOLER FOR A COMPUTING DEVICE

Organization Name

ADVANCED MICRO DEVICES, INC.

Inventor(s)

CHRISTOPHER M. Helberg of AUSTIN TX (US)

CHRISTOPHER M. Jaggers of AUSTIN TX (US)

ROBERT EDWARD Radke of AUSTIN TX (US)

MUSTANSIR M. Pratapgarhwala of AUSTIN TX (US)

MICHAEL J. Austin of AUSTIN TX (US)

SUKESH Shenoy of Austin TX (US)

COMPONENT COOLER FOR A COMPUTING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17956799 titled 'COMPONENT COOLER FOR A COMPUTING DEVICE

Simplified Explanation

The apparatus described in the patent application is designed for component cooling by utilizing multiple heat transfer paths and a manifold to efficiently transfer heat away from heat-generating electronic components.

• The first heat transfer element is connected to the electronic component to absorb heat.
• The second heat transfer element is used to dissipate the heat absorbed by the first element.
• A plurality of heat transfer paths are established between the first and second heat transfer elements to provide separate heat conduction paths.
• The manifold includes fluid passages that allow a heat transfer fluid to come into contact with both heat transfer elements for efficient cooling.

Potential Applications

This technology can be applied in various electronic devices such as computers, servers, and other equipment with heat-generating components that require efficient cooling to maintain optimal performance.

Problems Solved

This technology addresses the issue of overheating in electronic components by providing an effective cooling system that can efficiently transfer heat away from the components, preventing potential damage due to excessive heat.

Benefits

- Improved cooling efficiency for electronic components - Enhanced performance and longevity of electronic devices - Reduced risk of overheating-related malfunctions or failures

Potential Commercial Applications

- Data centers - Telecommunications equipment - Industrial machinery

Possible Prior Art

One possible prior art could be the use of traditional heat sinks or fans for cooling electronic components. However, the described apparatus offers a more efficient and targeted approach to cooling by utilizing multiple heat transfer paths and a manifold system.

How does this technology compare to other cooling solutions currently available in the market?

This article does not provide a direct comparison with other cooling solutions, so it is unclear how this technology stands out in terms of performance, cost, or ease of implementation.

What are the specific electronic components or devices that can benefit the most from this cooling apparatus?

The article does not specify which electronic components or devices would benefit the most from this technology, leaving room for further exploration into its potential applications and limitations.

Original Abstract Submitted

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.