17956793. COMPONENT COOLER WITH MULTIPLE FLUID PATHS simplified abstract (ADVANCED MICRO DEVICES, INC.)
Contents
- 1 COMPONENT COOLER WITH MULTIPLE FLUID PATHS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPONENT COOLER WITH MULTIPLE FLUID PATHS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
COMPONENT COOLER WITH MULTIPLE FLUID PATHS
Organization Name
Inventor(s)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
ROBERT EDWARD Radke of AUSTIN TX (US)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
COMPONENT COOLER WITH MULTIPLE FLUID PATHS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956793 titled 'COMPONENT COOLER WITH MULTIPLE FLUID PATHS
Simplified Explanation
The apparatus described in the patent application is designed to cool components by using a manifold to split a single fluid flow into two separate flows that are directed to different heat transfer elements.
- The apparatus includes a first heat transfer element that is connected to a heat-generating component.
- A second heat transfer element is also connected to the same heat-generating component.
- A manifold is used to divide a single fluid flow of a heat transfer medium into two separate flows.
- One flow is directed to the first heat transfer element, while the other flow is directed to the second heat transfer element.
Potential Applications
The technology described in this patent application could be applied in various industries where cooling of components is essential, such as:
- Electronics manufacturing
- Automotive industry
- Aerospace industry
Problems Solved
This technology helps to efficiently cool heat-generating components by providing dedicated cooling to each element, preventing overheating and potential damage.
Benefits
The benefits of this technology include:
- Improved cooling efficiency
- Enhanced component longevity
- Reduced risk of overheating and malfunctions
Potential Commercial Applications
With its ability to efficiently cool components, this technology could be used in various commercial applications, such as:
- Data centers
- Electric vehicles
- Industrial machinery
Possible Prior Art
One possible prior art for this technology could be similar cooling systems used in the automotive industry or data centers. However, the specific design and method of splitting the fluid flow may be unique to this patent application.
Unanswered Questions
How does this technology compare to traditional cooling methods?
This article does not provide a direct comparison between this technology and traditional cooling methods. Further research or testing may be needed to determine the efficiency and effectiveness of this apparatus compared to existing cooling systems.
What is the potential impact of this technology on energy consumption?
The article does not address the potential impact of this technology on energy consumption. It would be important to understand if this apparatus could lead to energy savings or increased energy usage in practical applications.
Original Abstract Submitted
An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.
