17956114. SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract (International Business Machines Corporation)
Contents
- 1 SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Organization Name
International Business Machines Corporation
Inventor(s)
Huai Huang of Clifton Park NY (US)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
Hosadurga Shobha of Niskayuna NY (US)
Ruilong Xie of Niskayuna NY (US)
Lawrence A. Clevenger of Saratoga Springs NY (US)
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956114 titled 'SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Simplified Explanation
The semiconductor structure described in the abstract consists of an interconnect line with multiple conducting line segments separated by isolating layers. Additionally, the structure includes a vertically stacked conducting line segment over a portion of the existing line segments.
- The semiconductor structure includes a first portion of an interconnect line with a first conducting line segment and a second conducting line segment separated by an isolating layer.
- The structure also features a second portion of the interconnect line with a third conducting line segment vertically stacked over at least a portion of the first and second conducting line segments.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
This technology helps solve the following issues:
- Improving interconnectivity in semiconductor devices
- Enhancing signal transmission efficiency
- Reducing signal interference
Benefits
The benefits of this technology include:
- Increased performance of semiconductor devices
- Enhanced reliability of integrated circuits
- Improved signal integrity
Potential Commercial Applications
A potential commercial application for this technology could be:
- Advanced microprocessor manufacturing for consumer electronics
Possible Prior Art
One possible prior art related to this technology is the use of stacked interconnect lines in semiconductor devices to improve signal transmission efficiency.
Unanswered Questions
How does this technology compare to existing methods of interconnect line design in terms of performance and efficiency?
This article does not provide a direct comparison between this technology and existing methods.
What are the specific manufacturing processes required to implement this semiconductor structure?
The article does not delve into the detailed manufacturing processes involved in implementing this technology.
Original Abstract Submitted
A semiconductor structure comprises a first portion of an interconnect line comprising a first conducting line segment and a second conducting line segment separated by an isolating layer, and a second portion of the interconnect line comprising a third conducting line segment vertically stacked over at least a portion of the first conducting line segment and at least a portion of the second conducting line segment.
