17955926. LOW CAPACITANCE ESD PROTECTION DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

LOW CAPACITANCE ESD PROTECTION DEVICES

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Sreeram Nasum Subramanyam of Bangalore (IN)

Shraddha Balasaheb Keripale of Kolhapur (IN)

Chinna Veerappan Venkatachalam of Bangalore (IN)

LOW CAPACITANCE ESD PROTECTION DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17955926 titled 'LOW CAPACITANCE ESD PROTECTION DEVICES

Simplified Explanation

The abstract describes a patent application for low capacitance bidirectional and unidirectional electrostatic discharge (ESD) protection devices for high voltage applications, such as 15 kV and 30 kV. The devices include a circuit of a diode and a Zener diode coupled via their anodes to form an NPN structure, along with another low capacitance diode coupled in series with the NPN structure. These circuits can be configured on separate dies and coupled via wire bonds. In a multichip module (MCM) topology, the NPN diode structure may be coupled to low capacitance diodes on one die, which is then connected to a third low capacitance diode on another die. Some arrangements may utilize an insulator with a single die, and FlipChip fabrication technology can be employed.

• The patent application describes a circuit design for low capacitance bidirectional and unidirectional ESD protection devices for high voltage applications.
• The devices consist of a combination of diodes, Zener diodes, and NPN structures to provide effective protection against electrostatic discharge.
• The circuits can be configured on separate dies and connected via wire bonds, enabling flexibility in design and implementation.
• In a multichip module (MCM) topology, multiple low capacitance diodes can be combined to enhance ESD protection capabilities.
• The use of an insulator with a single die and FlipChip fabrication technology further enhances the performance and reliability of the devices.

Potential Applications

The technology described in the patent application can be applied in various high voltage applications where protection against electrostatic discharge is critical, such as in industrial equipment, power distribution systems, and automotive electronics.

Problems Solved

1. Provides effective protection against electrostatic discharge in high voltage applications. 2. Offers flexibility in design and implementation by allowing circuits to be configured on separate dies and connected via wire bonds.

Benefits

1. Low capacitance design ensures minimal impact on signal integrity. 2. Enhanced ESD protection capabilities for high voltage applications. 3. Flexibility in design and implementation for different system requirements. 4. Improved reliability and performance in harsh operating environments.

Potential Commercial Applications

The technology can be commercialized for use in industrial equipment, power distribution systems, automotive electronics, and other high voltage applications requiring robust ESD protection.

Possible Prior Art

There may be prior art related to ESD protection devices for high voltage applications using similar circuit configurations and components. Further research and analysis would be needed to identify specific examples of prior art in this field.

Unanswered Questions

== How does this technology compare to existing ESD protection devices for high voltage applications? The article does not provide a direct comparison with existing ESD protection devices in terms of performance, reliability, or cost-effectiveness. Further analysis and testing would be required to evaluate the advantages of this technology over existing solutions.

== What are the potential challenges in implementing this technology in practical applications? The article does not address the potential challenges that may arise during the implementation of this technology in real-world applications. Factors such as compatibility with existing systems, manufacturing costs, and regulatory requirements could pose challenges that need to be considered.

Original Abstract Submitted

Examples of low capacitance bidirectional and unidirectional electrostatic discharge (ESD) protection devices for high voltage (e.g., 15 kV, 30 kV) applications are provided. Such devices include a circuit of a diode and a Zener diode coupled via their anodes to form an NPN structure and another, low capacitance diode coupled in series with the NPN structure. Such circuit may be configured on each of two dies, and the circuits coupled via wire bonds. Additional wire bonds may be used to respectively couple two pins of the device to the two circuits, or the pins may be coupled to the circuits via respective conductive die attaches. In a multichip module (MCM) topology, the NPN diode structure may be coupled to two low capacitance diodes on one die, and that circuit may be coupled to a third low capacitance diode disposed on another die. Some arrangements employ an insulator in conjunction with a single die. Some arrangements enable FlipChip fabrication technology.