17955796. EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Zhiqiang Xiang of Shenzhen (CN)
Xiaojing Liao of Shanghai (CN)
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17955796 titled 'EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
Simplified Explanation
The patent application describes an application that provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate includes an insulation layer, an electronic element, and a conductive connector embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element and includes at least one fuse unit.
- The embedded substrate includes an insulation layer, electronic element, and conductive connector.
- The conductive connector is electrically connected to the electronic element.
- The conductive connector includes at least one fuse unit.
- The fuse unit has a fusible structure and two electrical connection ends.
- The fusible structure is connected between the two electrical connection ends in the direction of the conductive connector's electrical path.
- The fusible structure is designed to blow when the passing current exceeds a preset current threshold.
- Blowing the fusible structure disconnects the electrical connection between the electronic element and an external connection end.
- This design helps to prevent current burning and reduces maintenance and replacement costs.
- The embedded substrate and circuit board assembly are compact in size.
Potential Applications
- Electronics manufacturing
- Circuit board assembly
- Embedded systems
Problems Solved
- Low maintenance and replacement costs during current burning prevention
- Compact volume for embedded substrates and circuit board assemblies
Benefits
- Reduced maintenance and replacement costs
- Compact size for embedded substrates and circuit board assemblies
Original Abstract Submitted
This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.
