17955660. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MEASURING FILM THICKNESS simplified abstract (Samsung Display Co., Ltd.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MEASURING FILM THICKNESS
Organization Name
Inventor(s)
JAISUN Kyoung of Cheonan-si (KR)
JONGYUN Park of Cheonan-si (KR)
SOOIM Jeong of Hwaseong-si (KR)
DEOKHYUN Hwang of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MEASURING FILM THICKNESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17955660 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD OF MEASURING FILM THICKNESS
Simplified Explanation
The patent application describes a substrate processing apparatus that includes a chamber, a stage, a deposition part, and a measurement part. The measurement part is used to measure the deposition material on the substrate.
- The substrate processing apparatus includes a chamber with an accommodation space.
- A stage is placed in the accommodation space and holds the substrate.
- A deposition part is located under the stage and sprays deposition material onto the substrate.
- A measurement part is positioned adjacent to the deposition part.
- The measurement part has an accommodation portion with an opening on at least one surface.
- A light source is placed in the accommodation portion and emits a first light.
- At least one transmission portion is placed in the opening, facing the light source, and receives the first light.
- A reception portion is positioned opposite the transmission portion and receives the second light reflected from the deposition material.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the production of semiconductors, where precise deposition of materials is crucial.
- Thin film coating: The apparatus can be utilized for depositing thin films on various substrates, such as glass or metal, for applications like optical coatings or protective layers.
- Solar cell production: The technology can be employed in the manufacturing of solar cells, where controlled deposition of materials is necessary.
Problems solved by this technology:
- Accurate measurement: The measurement part allows for precise measurement of the deposition material on the substrate, ensuring quality control in the manufacturing process.
- Real-time monitoring: The apparatus enables real-time monitoring of the deposition process, allowing for adjustments and corrections if needed.
- Simplified setup: The substrate processing apparatus provides a simplified setup for measuring the deposition material, reducing complexity and improving efficiency.
Benefits of this technology:
- Improved quality control: The measurement part ensures accurate measurement of the deposition material, leading to improved quality control in the manufacturing process.
- Enhanced efficiency: Real-time monitoring allows for immediate adjustments, reducing the need for rework and improving overall efficiency.
- Simplified operation: The simplified setup of the apparatus makes it easier to use and maintain, reducing complexity and potential errors.
Original Abstract Submitted
A substrate processing apparatus includes a chamber including an accommodation space, a stage disposed in the accommodation space and provided with a substrate disposed thereon, a deposition part disposed under the stage and spraying at least one deposition material to the substrate, and a measurement part disposed adjacent to the deposition part. The measurement part includes an accommodation portion provided with an opening defined through at least one surface thereof, a light source disposed in the accommodation portion and irradiating a first light, at least one transmission portion disposed in the opening, facing the light source, and receiving the first light, and a reception portion facing the at least one transmission portion and receiving the first light reflected from the at least one deposition material as a second light.
