17954960. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17954960 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes a substrate processing apparatus that is used in various manufacturing processes.
- The apparatus includes a substrate support that can hold multiple substrates.
- It also has a chamber sidewall that surrounds the side surface of the substrate support.
- An upper plate is present on the substrate support, which is divided into multiple plate portions that are spaced apart from the substrate support.
- The plate portions and the substrate support together create different process regions and a separation between them.
- The process regions include a pretreatment process region and a deposition process region.
- The pretreatment process region has a lower height compared to the deposition process region.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the fabrication of semiconductor devices.
- Thin film deposition: It can be used for depositing thin films on substrates in various industries such as electronics, optics, and solar cells.
Problems solved by this technology:
- Efficient processing: The separation between process regions allows for different processes to be carried out simultaneously, improving overall efficiency.
- Uniformity: The design of the apparatus ensures that the deposition process region has a greater height, which can lead to more uniform deposition of materials on the substrates.
Benefits of this technology:
- Increased productivity: The ability to perform multiple processes simultaneously reduces processing time and increases productivity.
- Improved quality: The uniform deposition of materials ensures consistent and high-quality results.
- Cost-effective: The efficient use of resources and improved productivity can lead to cost savings in manufacturing processes.
Original Abstract Submitted
A substrate processing apparatus includes: configured to support a plurality of substrates; a chamber sidewall surrounding at least a side surface of the substrate support; and an upper plate including a plurality of plate portions on the substrate support and spaced apart from the substrate support. The plurality of plate portions and the substrate support collectively at least partially define a plurality of process regions between the plurality of plate portions and the substrate support and a separation between at least two process regions of the plurality of process regions. The plurality of process regions include a pretreatment process region between the pretreatment process plate portion and the substrate support and having a first height, and a deposition process region between the deposition process plate portion and the substrate support and having a second height, greater than the first height.
