17951274. MOBILE TERMINAL AND MIDDLE FRAME ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
Contents
MOBILE TERMINAL AND MIDDLE FRAME ASSEMBLY
Organization Name
Inventor(s)
MOBILE TERMINAL AND MIDDLE FRAME ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 17951274 titled 'MOBILE TERMINAL AND MIDDLE FRAME ASSEMBLY
Simplified Explanation
The abstract describes a mobile terminal with improved heat dissipation performance. The mobile terminal includes a middle frame assembly that supports an electronic component with a heat source. The middle frame assembly consists of a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame has a heat dissipation region that corresponds to the heat source. The first vapor chamber is placed in the heat dissipation region, and the heat pipes are connected to the first vapor chamber to dissipate heat from it.
- The mobile terminal includes a middle frame assembly that supports an electronic component with a heat source.
- The middle frame assembly consists of a middle frame, one or more heat pipes, and a first vapor chamber.
- The middle frame has a heat dissipation region that corresponds to the heat source.
- The first vapor chamber is placed in the heat dissipation region.
- The heat pipes are connected to the first vapor chamber to dissipate heat from it.
Potential Applications
This technology can be applied in various mobile devices such as smartphones, tablets, and laptops to improve their heat dissipation capabilities. It can also be used in other electronic devices that generate significant heat.
Problems Solved
The technology addresses the issue of heat buildup in mobile devices, which can lead to performance degradation and potential damage to internal components. By providing an efficient heat dissipation system, the technology helps to prevent overheating and ensures optimal performance.
Benefits
- Improved heat dissipation performance in mobile devices.
- Prevention of performance degradation and potential damage caused by heat buildup.
- Enhanced overall performance and longevity of the mobile device.
Original Abstract Submitted
A mobile terminal includes middle frame assembly that is configured to bear an electronic component in the mobile terminal. The electronic component includes a heat source, and the middle frame assembly includes a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame includes a heat dissipation region corresponding to the heat source. The first vapor chamber is accommodated in the heat dissipation region. The heat pipes are connected to the first vapor chamber, and are configured to dissipate heat from the first vapor chamber. This structure of the mobile terminal and the middle frame assembly of the mobile terminal improves heat dissipation performance of the mobile terminal.
