17949937. EDGE DEFECT DETECTION VIA IMAGE ANALYTICS simplified abstract (Applied Materials, Inc.)

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EDGE DEFECT DETECTION VIA IMAGE ANALYTICS

Organization Name

Applied Materials, Inc.

Inventor(s)

Yash Chhabra of Bangalore (IN)

Abyaya Dhar of Bangalore (IN)

Joseph Liu of Zhubei City (TW)

Yi Nung Wu of Taoyuan City (TW)

Boon Sen Chan of Singapore (SG)

Sidda Reddy Kurakula of Bengaluru (IN)

Chandrasekhar Roy of Bangalore (IN)

EDGE DEFECT DETECTION VIA IMAGE ANALYTICS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17949937 titled 'EDGE DEFECT DETECTION VIA IMAGE ANALYTICS

Simplified Explanation

The present disclosure involves using image analytics to detect edge defects in a susceptor pocket of a substrate processing system. The method includes identifying an image of the edge of the susceptor pocket, predicting if the property values of the edge meet threshold values, and performing a corrective action if necessary.

  • Edge defect detection via image analytics:
   - Identify image of susceptor pocket edge
   - Predict if property values meet threshold values
   - Perform corrective action if needed
    • Potential Applications:**

This technology can be applied in semiconductor manufacturing, solar panel production, and other industries where precise edge detection is crucial for quality control.

    • Problems Solved:**

This innovation helps in early detection of edge defects in susceptors, leading to improved product quality and reduced manufacturing downtime.

    • Benefits:**

- Enhanced quality control - Increased efficiency in manufacturing processes - Cost savings through early defect detection

    • Potential Commercial Applications:**

"Edge Defect Detection Technology for Improved Quality Control in Semiconductor Manufacturing"

    • Possible Prior Art:**

There may be prior art related to image analytics for defect detection in manufacturing processes, but specific examples would need to be researched further.

    • Unanswered Questions:**

1. How does this technology compare to traditional methods of edge defect detection in substrate processing systems? 2. What are the limitations of using image analytics for edge defect detection in susceptors?


Original Abstract Submitted

The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.