17948664. FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract (International Business Machines Corporation)
Contents
- 1 FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
Organization Name
International Business Machines Corporation
Inventor(s)
Tao Li of Slingerlands NY (US)
Ruilong Xie of Niskayuna NY (US)
Chih-Chao Yang of Glenmont NY (US)
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17948664 titled 'FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
Simplified Explanation
The semiconductor structure described in the patent application includes a power distribution structure, an interconnect structure, and at least one decoupling capacitor connected between the power distribution structure and the interconnect structure.
- The power distribution structure is placed on a first wafer.
- The interconnect structure is placed on the first wafer and a second wafer.
- The decoupling capacitor is connected between the power distribution structure and the interconnect structure.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Integrated circuits
- Power distribution systems
Problems Solved
This technology helps in:
- Improving power distribution efficiency
- Reducing noise in interconnect structures
- Enhancing overall performance of semiconductor devices
Benefits
The benefits of this technology include:
- Increased reliability of semiconductor structures
- Enhanced signal integrity
- Improved power management
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Electronics industry
- Telecommunications sector
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor structures with decoupling capacitors for noise reduction.
Unanswered Questions
How does this technology compare to traditional power distribution structures in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and traditional power distribution structures. It would be beneficial to understand the specific advantages and disadvantages of this new approach.
What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
The article does not address the cost considerations associated with incorporating this technology. Understanding the cost implications could be crucial for companies looking to adopt this innovation.
Original Abstract Submitted
A semiconductor structure includes a power distribution structure disposed on a first wafer, an interconnect structure disposed on the first wafer and a second wafer, and at least one decoupling capacitor connected between the power distribution structure and the interconnect structure.
