17948586. THIN FILM CAPACITORS simplified abstract (Intel Corporation)

THIN FILM CAPACITORS

Organization Name

Intel Corporation

Inventor(s)

Mahdi Mohammadighaleni of Phoenix AZ (US)

Benjamin Duong of Phoenix AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Joshua Stacey of Chandler AZ (US)

Miranda Ngan of Chandler AZ (US)

Dilan Seneviratne of Chandler AZ (US)

Thomas Heaton of Mesa AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Whitney Bryks of Chandler AZ (US)

Jieying Kong of Chandler AZ (US)

THIN FILM CAPACITORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17948586 titled 'THIN FILM CAPACITORS

Simplified Explanation

The patent application describes an apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) with a glass core, through glass via (TGV), first and second conductive materials, and a dielectric material.

• Glass core with TGV: The 3D TFC includes a glass core with a TGV that contains the first conductive material forming the first electrode of the capacitor.
• Second electrode: The second electrode of the 3D TFC is made of a second conductive material.
• Dielectric material: The dielectric material is in contact with the first and second conductive materials, physically separating them vertically and horizontally.

Potential Applications

The technology can be applied in the manufacturing of high-density capacitors for electronic devices, energy storage systems, and integrated circuits.

Problems Solved

This innovation solves the challenge of creating compact and efficient capacitors in a three-dimensional structure, improving performance and reducing space requirements.

Benefits

The benefits of this technology include increased capacitance in a smaller footprint, improved energy storage capabilities, and enhanced overall performance of electronic devices.

Potential Commercial Applications

Potential commercial applications include the production of advanced capacitors for smartphones, laptops, electric vehicles, and renewable energy systems.

Possible Prior Art

Prior art in the field of thin-film capacitors and three-dimensional structures may exist, but specific examples are not provided in this patent application.

How does this technology compare to traditional two-dimensional capacitors in terms of performance and efficiency?

The article does not provide a direct comparison between the 3D TFC and traditional 2D capacitors in terms of performance metrics such as capacitance, size, or energy storage capabilities.

What are the potential challenges or limitations in scaling up this technology for mass production?

The article does not address the potential challenges or limitations that may arise when scaling up the production of 3D TFCs for mass commercial applications, such as cost-effectiveness, manufacturing complexity, or reliability issues.

Original Abstract Submitted

An apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) are provided. A 3D TFC can include a glass core, a through glass via (TGV) in the glass core including first conductive material, the first conductive material forming a first electrode of the 3D MIM capacitor, a second conductive material acting as a second electrode of the 3D MIM capacitor, and a dielectric material in contact with the first and second conductive materials, the dielectric material extending vertically and horizontally and physically separating the first and second conductive materials.