17946962. DOUBLE-SIDED COOLING APPARATUS FOR POWER MODULE simplified abstract (KIA CORPORATION)
Contents
DOUBLE-SIDED COOLING APPARATUS FOR POWER MODULE
Organization Name
Inventor(s)
Hyong Joon Park of Hwaseong-Si (KR)
Sang Hun Lee of Taebaek-Si (KR)
DOUBLE-SIDED COOLING APPARATUS FOR POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17946962 titled 'DOUBLE-SIDED COOLING APPARATUS FOR POWER MODULE
Simplified Explanation
The abstract describes a double-sided cooling apparatus for a power module. It consists of a first cooling module that is in contact with one side of the power module and allows cooling fluid to flow through it, and a second cooling module that is in contact with the opposite side of the power module and includes a tube for the cooling fluid to flow through.
- The first cooling module includes a manifold cover with cooling channels formed by guide walls and a fin plate with fins.
- The cooling channels in the first cooling module have a blocker that causes the cooling fluid to flow in a mixed form of lateral flow and vertical flow.
Potential applications of this technology:
- Cooling power modules in electronic devices such as computers, servers, and electric vehicles.
- Cooling high-power electronic components in industrial machinery and equipment.
Problems solved by this technology:
- Efficient cooling of power modules to prevent overheating and improve performance and reliability.
- Uniform distribution of cooling fluid across the power module surface.
Benefits of this technology:
- Enhanced cooling efficiency due to the mixed flow of cooling fluid.
- Compact design allows for effective cooling in limited space.
- Improved thermal management prolongs the lifespan of power modules.
- Increased performance and reliability of electronic devices.
Original Abstract Submitted
A double-sided cooling apparatus for a power module, includes a first cooling module provided to be in contact with a first side of the power module to which a switching device is mounted, and allowing cooling fluid to flow therein; and a second cooling module provided to be in contact with a second side of the power module provided opposite to the first side, and including a tube allowing the cooling fluid to flow in the tube, wherein the first cooling module includes a manifold cover including a plurality of cooling channels formed by a plurality of guide walls extending in a first direction, and a fin plate including a plurality of fins extending in a second direction intersecting the first direction, and the cooling channel includes a blocker formed in a predetermined portion of the cooling channel so that the cooling fluid in the first cooling module flows in a mixed form of lateral flow and vertical flow of the cooling fluid.