17945910. ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL simplified abstract (Applied Materials, Inc.)
Contents
- 1 ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL
Organization Name
Inventor(s)
Ruiping Wang of San Jose CA (US)
Guan Huei See of Singapore (SG)
Ananthkrishna Jupudi of Singapore (SG)
Praveen Kumar Choragudi of Singapore (SG)
ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 17945910 titled 'ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL
Simplified Explanation
Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.
- Placing dirty tools on a holder in a bonding chamber
- Transferring the holder to a cleaning chamber
- Cleaning the dirty tools to produce cleaned tools
- Inspecting the cleaned tools in an inspection chamber
- Transferring the cleaned tools back to the bonding chamber
Potential Applications
The technology can be applied in semiconductor manufacturing, where clean tooling parts are essential for processing substrates effectively.
Problems Solved
This technology solves the problem of efficiently cleaning tooling parts in a substrate processing tool, ensuring optimal performance and preventing contamination of substrates.
Benefits
The benefits of this technology include improved substrate processing efficiency, reduced risk of contamination, and increased tooling lifespan.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and companies involved in substrate processing.
Possible Prior Art
One possible prior art could be the use of manual cleaning processes for tooling parts in substrate processing tools, which may be time-consuming and less effective compared to automated cleaning methods.
Unanswered Questions
How does this technology compare to existing cleaning methods in terms of efficiency and effectiveness?
This article does not provide a direct comparison between this technology and existing cleaning methods.
What are the potential cost implications of implementing this technology in a substrate processing tool?
The article does not address the potential cost implications of implementing this technology.
Original Abstract Submitted
Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber
