17943799. LINE EXTENSION FOR SKIP-LEVEL VIA LANDING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

LINE EXTENSION FOR SKIP-LEVEL VIA LANDING

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Brent A. Anderson of Jericho VT (US)

Ruilong Xie of Niskayuna NY (US)

REINALDO Vega of Mahopac NY (US)

Albert M. Chu of Nashua NH (US)

LINE EXTENSION FOR SKIP-LEVEL VIA LANDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17943799 titled 'LINE EXTENSION FOR SKIP-LEVEL VIA LANDING

Simplified Explanation

The abstract describes a skip-level via structure that connects a third level of interconnect wiring to a first level or a fourth level of interconnect wiring to a first level, enabling connections even when the levels do not line up and providing a low resistance connection due to increased contact area.

• Skip-level via structure connects third level of interconnect wiring to first level
• Enables connection even when levels do not line up
• Provides low resistance connection for fourth level of interconnect wiring to first level
• Increased contact area improves connection quality

Potential Applications

The skip-level via structure can be used in:

• Semiconductor manufacturing
• Integrated circuit design
• High-density electronic devices

Problems Solved

The skip-level via structure solves issues related to:

• Aligning different levels of interconnect wiring
• Ensuring low resistance connections
• Improving contact area for better electrical connections

Benefits

The skip-level via structure offers benefits such as:

• Enhanced electrical connectivity
• Improved signal transmission
• Higher reliability in electronic devices

Potential Commercial Applications

Optimizing Electrical Connections in Semiconductor Devices: Enhancing Interconnect Wiring with Skip-Level Via Structure

Original Abstract Submitted

A skip-level via structure is provided that electrically connects a third level of interconnect wiring to a first level of interconnect wiring or a fourth level of interconnect wiring to a first level of interconnect wiring. In the first instance, the skip-level via structure enables connection even when the first level of interconnect wiring and the third level of interconnect wiring do not line up. In the second instance, the skip-level via structure enables a low resistance connection of the fourth level of interconnect wiring to the first level of interconnect wiring due to increased contact area.