17943564. Large Surface VBPR for Robust Alignment in Advanced Technology Nodes simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
Contents
- 1 Large Surface VBPR for Robust Alignment in Advanced Technology Nodes
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Large Surface VBPR for Robust Alignment in Advanced Technology Nodes - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Original Abstract Submitted
Large Surface VBPR for Robust Alignment in Advanced Technology Nodes
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Tsung-Sheng Kang of Ballston Lake NY (US)
Oscar Van Der Straten of Guilderland Center NY (US)
Koichi Motoyama of Clifton Park NY (US)
Alexander Reznicek of Troy NY (US)
Large Surface VBPR for Robust Alignment in Advanced Technology Nodes - A simplified explanation of the abstract
This abstract first appeared for US patent application 17943564 titled 'Large Surface VBPR for Robust Alignment in Advanced Technology Nodes
Simplified Explanation
The semiconductor device described in the abstract features a contact with a first section on the front side of a source or drain, and a second section extending to the backside of the source or drain. The second section includes a via and a connection area, with the connection area having a larger width than the via.
- Contact with two sections: The contact in the semiconductor device has a first section on the front side of the source or drain, and a second section extending to the backside.
- Via and connection area: The second section of the contact is comprised of a via and a connection area, with the connection area having a larger width than the via.
- Width difference: The via has a first width, while the connection area has a second width that is larger than the first width.
Potential Applications
This technology could be applied in the development of advanced semiconductor devices for various electronic applications, such as integrated circuits, sensors, and memory devices.
Problems Solved
This innovation helps in improving the efficiency and performance of semiconductor devices by providing a more reliable and stable contact structure between the source or drain and the external circuitry.
Benefits
The use of this contact structure can lead to enhanced electrical connectivity, reduced resistance, and improved overall functionality of semiconductor devices.
Potential Commercial Applications
- Enhancing the performance of integrated circuits
- Improving the reliability of sensors
- Enhancing the functionality of memory devices
Original Abstract Submitted
A semiconductor device comprising a contact comprising a first section and a second section; wherein the first section of the contact is located on a front side of a source or drain; wherein the second section extends from the front side of the source or drain to a backside of the source or drain; wherein the second section of the contact is comprised of a via and a connection area; wherein the via has a first width and the connection area has a second width, and wherein the second width is larger than the first width.
