17940911. DECOUPLING CAPACITOR ARCHITECTURE simplified abstract (QUALCOMM Incorporated)
Contents
DECOUPLING CAPACITOR ARCHITECTURE
Organization Name
Inventor(s)
Keyurkumar Karsanbhai Kansagra of Bangalore (IN)
Manjanaika Chandranaika of Bangalore (IN)
Kamesh Medisetti of Bangalore (IN)
DECOUPLING CAPACITOR ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17940911 titled 'DECOUPLING CAPACITOR ARCHITECTURE
Simplified Explanation
The abstract of the patent application describes a chip with first source/drain contacts, first gates, a first bridge, and metal routing.
- Chip includes first source/drain contacts formed over a first oxide diffusion (OD).
- First gates are disposed between respective pairs of the first source/drain contacts.
- Chip includes a first bridge coupling the first source/drain contacts and gates.
- First metal routing is coupled to the first source/drain contacts.
- Second metal routing is coupled to the second source/drain contacts.
Potential Applications
- Semiconductor industry for integrated circuits.
- Electronics manufacturing for improved chip performance.
Problems Solved
- Enhanced connectivity between components on the chip.
- Improved signal transmission and processing.
Benefits
- Increased efficiency in chip design.
- Enhanced functionality and performance.
- Better reliability and durability of the chip.
Original Abstract Submitted
In certain aspects, a chip includes first source/drain contacts formed over a first oxide diffusion (OD), and first gates, wherein each of the first gates is disposed between a respective pair of the first source/drain contacts. The chip also includes a first bridge coupling a first one of the first source/drain contacts, a first one of the first gates, and a second one of the first source/drain contacts. The chip also includes a first metal routing coupled to the first one of the first source/drain contacts, and a second metal routing coupled to the second one of the first source/drain contacts.
