17938344. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Unbyoung Kang of Hwaseong-si (KR)
Donghoon Won of Cheonan-si (KR)
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17938344 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The patent application describes a semiconductor device that includes a semiconductor substrate with a device region and a wiring structure. The device also includes an insulating material layer on the side surface of the wiring structure, which is connected to the side surface of the semiconductor substrate.
- The semiconductor device includes a semiconductor substrate with a device region and a wiring structure.
- An insulating material layer is present on the side surface of the wiring structure and is connected to the side surface of the semiconductor substrate.
- The side surface of the insulating material layer has a wave-shaped pattern with repeated concave-convex portions in the direction of the wiring structure.
- The side surface of the semiconductor substrate also has a wave-shaped pattern with repeated concave-convex portions in the same direction.
Potential applications of this technology:
- This semiconductor device can be used in various electronic devices such as smartphones, computers, and other consumer electronics.
- It can be utilized in the automotive industry for advanced driver assistance systems, infotainment systems, and other electronic components in vehicles.
- This technology can also find applications in the medical field for medical devices and equipment.
Problems solved by this technology:
- The wave-shaped pattern on the side surfaces of the insulating material layer and the semiconductor substrate helps in improving the adhesion between the two surfaces.
- It provides better electrical connectivity and reduces the risk of disconnection or failure of the wiring structure.
- The wave-shaped pattern also helps in reducing stress and strain on the device, enhancing its overall reliability and durability.
Benefits of this technology:
- Improved adhesion between the insulating material layer and the semiconductor substrate ensures better performance and reliability of the semiconductor device.
- Enhanced electrical connectivity reduces the risk of failure and improves the overall functionality of the device.
- The wave-shaped pattern helps in reducing stress and strain, leading to increased durability and longevity of the semiconductor device.
Original Abstract Submitted
A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposing each other, and a side surface between the first and second surfaces, and including a device region on the first surface a wiring structure on the surface of the semiconductor substrate, and having a dielectric layer and a metal wiring in the dielectric layer and electrically connected to the device region, and an insulating material layer on a side surface of the wiring structure and having a side surface connected to the side surface of the semiconductor substrate. The side surface of the insulating material layer has a first wave-shaped pattern in which concave-convex portions are repeated in a direction of the wiring structure that is perpendicular to the semiconductor substrate, and the side surface of the semiconductor substrate has a second wave-shaped pattern in which concave-convex portions are repeated in the direction.
