17937953. Component Shielding simplified abstract (GOOGLE LLC)
Contents
- 1 Component Shielding
Component Shielding
Organization Name
Inventor(s)
Wen Shian Lin of New Taipei City (TW)
Chien Hua Hsu of New Taipei City (TW)
Shihwen Lee of New Taipei City (TW)
Bing-Feng Wang of New Taipei City (TW)
Component Shielding - A simplified explanation of the abstract
This abstract first appeared for US patent application 17937953 titled 'Component Shielding
Simplified Explanation
The patent application describes techniques and apparatuses for component shielding, including a system with a printed circuit board (PCB), a device on the PCB, and a component shield with a wall structure and cover structure connected to it. The system also includes a housing structure and a shielding layer between the cover and housing structures, with an irregular cross-section including a protrusion.
- The system includes a printed circuit board (PCB) with a device and a component shield with a wall and cover structure.
- The housing structure is oriented along a plane parallel to the PCB, defining a shielded space for the device and shield.
- A shielding layer with an irregular cross-section and a protrusion is located between the cover and housing structures.
Potential Applications
This technology could be applied in electronic devices, telecommunications equipment, and industrial machinery where component shielding is necessary.
Problems Solved
This technology helps prevent electromagnetic interference, protects sensitive components, and ensures proper functioning of electronic devices.
Benefits
The system provides effective shielding, reduces interference, enhances device performance, and prolongs the lifespan of electronic components.
Potential Commercial Applications
This technology could be used in the manufacturing of smartphones, computers, routers, and other electronic devices to improve their reliability and performance.
Possible Prior Art
One possible prior art could be the use of shielding layers in electronic devices to reduce electromagnetic interference and protect components.
Unanswered Questions
How does this technology compare to existing component shielding methods in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing methods.
What are the environmental implications of using this technology in electronic devices?
This article does not address the environmental impact of implementing this technology in electronic devices.
Original Abstract Submitted
Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.
