17937764. TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (International Business Machines Corporation)
Contents
- 1 TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Organization Name
International Business Machines Corporation
Inventor(s)
Chinami Marushima of Urayasu-city (JP)
Toyohiro Aoki of Yokohama (JP)
Takashi Hisada of Hachiouji-shi (JP)
Marc A. Bergendahl of Rensselaer NY (US)
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17937764 titled 'TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with a cavity and a trench, a first chip, a second chip, a bridge chip interconnecting the first and second chips and residing in the cavity, and underfill material filling the cavity and trench.
- The semiconductor device includes a substrate with a cavity and a trench.
- The device has a first chip and a second chip on the substrate.
- A bridge chip interconnects between the first and second chips and resides in the cavity.
- Underfill material fills the cavity and trench, surrounding the bridge chip.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor manufacturing
- Electronics industry
- Microchip design and production
Problems Solved
This technology addresses the following issues:
- Improving interconnection between chips on a substrate
- Enhancing the structural integrity of semiconductor devices
- Facilitating the manufacturing process of complex electronic components
Benefits
The benefits of this technology include:
- Increased reliability of semiconductor devices
- Improved performance of electronic systems
- Enhanced durability of microchips
Potential Commercial Applications
A potential commercial application of this technology could be in:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art related to this technology is the use of underfill materials in semiconductor packaging to improve mechanical strength and reliability of electronic devices.
Unanswered Questions
How does this technology impact the cost of semiconductor manufacturing?
This article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes.
What are the environmental considerations of using underfill materials in semiconductor devices?
The environmental impact of using underfill materials in semiconductor devices is not discussed in this article.
Original Abstract Submitted
A semiconductor device includes a substrate, which further includes a cavity and a trench extended from the cavity. The semiconductor includes a first chip and a second chip on the substrate, a bridge chip interconnecting between the first and second chips and residing in the cavity, and underfill material filling the cavity and the trench, and surrounding the bridge chip.
