17937487. SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
Organization Name
Inventor(s)
KWANGSUB Yoon of Yongin-si (KR)
SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17937487 titled 'SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
Simplified Explanation
The abstract describes a spin coater used in semiconductor fabrication, which includes a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing consists of a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.
- The spin coater is used in the process of semiconductor fabrication.
- It includes a spin chuck, nozzle, nozzle housing, purge gas supply, and organic solvent supply.
- The nozzle housing has a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.
- The organic solvent is stored in the solvent storage groove.
- The nozzle is inserted into the nozzle insert hole and connected to the gas supply hole.
- The spin coater is used to apply a thin layer of organic solvent onto a semiconductor wafer.
- The purge gas supply is used to remove excess solvent from the wafer surface.
Potential Applications
- Semiconductor fabrication processes
- Thin film deposition
Problems Solved
- Efficient and controlled application of organic solvent onto semiconductor wafers
- Removal of excess solvent from the wafer surface
Benefits
- Improved quality and consistency of semiconductor fabrication
- Reduced waste of organic solvent
- Increased efficiency in the fabrication process
Original Abstract Submitted
Systems and methods for semiconductor fabrication are described. A spin coater comprises a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing includes a lower housing including a solvent storage groove in which the organic solvent is stored, and an upper housing on the lower housing. The upper housing includes a nozzle insert hole on the solvent storage groove and receives the nozzle, and a gas supply hole connected to one side of the nozzle insert hole.
