17936843. ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract (International Business Machines Corporation)

ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS

Organization Name

International Business Machines Corporation

Inventor(s)

Vivekananda P. Adiga of Ossining NY (US)

Russell A. Budd of North Salem NY (US)

Charles Thomas Rettner of San Jose CA (US)

Stephen M. Gates of New York NY (US)

ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17936843 titled 'ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS

Simplified Explanation

The abstract describes a method of constructing a superconducting switch by fabricating a superconducting metal line on a substrate and releasing the center portion of the line through etch release holes to reduce undercut distance.

• Fabrication of a superconducting metal line on a substrate
• Etch release holes provided in the center portion of the metal line
• Anisotropic etch used to release the center portion of the metal line
• Reduction of undercut distance on the substrate

Potential Applications

The technology could be applied in superconducting electronics, quantum computing, and high-speed computing systems.

Problems Solved

This technology solves the problem of reducing undercut distance during the fabrication of superconducting switches, which can improve the overall performance and reliability of the devices.

Benefits

The benefits of this technology include improved efficiency, reduced energy consumption, and enhanced functionality of superconducting switches.

Potential Commercial Applications

Potential commercial applications of this technology include superconducting electronics, quantum computing devices, and high-speed data processing systems.

Possible Prior Art

One possible prior art could be the use of traditional etching techniques in the fabrication of superconducting devices.

How does this technology compare to existing methods of fabricating superconducting switches?

This article does not provide a direct comparison with existing methods of fabricating superconducting switches. It would be helpful to know the specific advantages and disadvantages of this new method compared to traditional techniques.

What are the limitations of this technology in terms of scalability and mass production?

The article does not address the scalability and mass production aspects of this technology. Understanding the limitations in these areas would be crucial for assessing the practicality of implementing this method on a larger scale.

Original Abstract Submitted

A method of constructing a superconducting switch includes providing a substrate. A first superconducting metal line is fabricated on the substrate, wherein the superconducting metal line has a left portion, a right portion, and a center portion patterned along a first crystalline direction of the substrate. One or more etch release holes are provided in the center portion of the first superconducting metal line. The center portion of the superconducting metal line is released from the substrate with an anisotropic etch through the etch release holes in a manner that reduces the undercut distance elsewhere on the substrate