17935886. AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Abstract
- 1.6 Patent/Innovation Explanation
- 1.7 Potential Applications
- 1.8 Problems Solved
- 1.9 Benefits
- 1.10 Original Abstract Submitted
AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME
Organization Name
Inventor(s)
Byung Hwa Seo of Suwon-si (KR)
AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17935886 titled 'AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME
Simplified Explanation
Abstract
The abstract of the patent application describes an amine-based curing agent and its use in a composition for semiconductor packages and electronic devices.
Patent/Innovation Explanation
- The patent application describes a new curing agent for use in semiconductor packages and electronic devices.
- The curing agent includes a compound represented by Chemical Formula 1.
- The composition containing the curing agent is used in the preparation of semiconductor packages and electronic devices.
Potential Applications
This technology has potential applications in various industries, including:
- Semiconductor manufacturing
- Electronics manufacturing
- Consumer electronics
- Telecommunications
- Automotive electronics
Problems Solved
The technology addresses the following problems:
- The need for an effective curing agent for semiconductor packages and electronic devices.
- The need for a composition that provides reliable and durable performance in these applications.
Benefits
The technology offers the following benefits:
- Improved reliability and durability of semiconductor packages and electronic devices.
- Enhanced performance and functionality of electronic devices.
- Increased efficiency and productivity in semiconductor manufacturing processes.
Original Abstract Submitted
An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition.
