17934195. SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract (International Business Machines Corporation)

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

Organization Name

International Business Machines Corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Brent A. Anderson of Jericho VT (US)

Albert M. Chu of Nashua NH (US)

Reinaldo Vega of Mahopac NY (US)

Ruilong Xie of Niskayuna NY (US)

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17934195 titled 'SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

Simplified Explanation

The interconnect structure described in the abstract connects an upper wiring line to a lower wiring line using a via and a wrap-around via portion. The wrap-around via portion extends along the sides of the lower wiring line, providing electrical contact.

• The interconnect structure connects an upper wiring line to a lower wiring line.
• A via connects the lower portion of the upper wiring line to the upper surface of the lower wiring line.
• A wrap-around via portion extends along the sides of the lower wiring line, providing electrical contact.

Potential Applications

The interconnect structure could be used in semiconductor devices, integrated circuits, and other electronic components where precise and reliable connections between wiring lines are required.

Problems Solved

This technology solves the problem of efficiently connecting wiring lines at different levels within a device, ensuring proper electrical contact and signal transmission.

Benefits

The interconnect structure allows for compact and reliable connections between wiring lines, improving the overall performance and functionality of electronic devices.

Potential Commercial Applications

• "Interconnect Structure for Efficient Wiring Line Connections in Electronic Devices" - This title is optimized for SEO.

Possible Prior Art

There may be prior art related to interconnect structures for wiring lines in electronic devices, but specific examples are not provided in this context.

How does this interconnect structure compare to traditional methods of connecting wiring lines in electronic devices?

The interconnect structure described in the patent application offers a more efficient and reliable way to connect wiring lines at different levels within a device compared to traditional methods. It provides a wrap-around via portion that extends along the sides of the lower wiring line, ensuring better electrical contact.

What are the potential challenges in implementing this interconnect structure in mass production of electronic devices?

One potential challenge in implementing this interconnect structure in mass production could be ensuring the precise alignment and placement of the vias and wrap-around via portions to guarantee proper electrical contact between the wiring lines. Additionally, optimizing the manufacturing process to achieve consistent and reliable results may also be a challenge.

Original Abstract Submitted

An interconnect structure for connecting an upper wiring line to a lower wiring line includes a via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line and a wrap-around via portion formed integrally with the via, the wrap-around portion extending along and electrically contacting a portion of the sides of the lower wiring line.