17932327. POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT simplified abstract (International Business Machines Corporation)

POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT

Organization Name

International Business Machines Corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

David Wolpert of Poughkeepsie NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17932327 titled 'POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT

Simplified Explanation

Embodiments include super via placement in the development of an integrated circuit. Aspects of the invention include obtaining a power distribution network for the integrated circuit (IC), wherein the PDN includes a plurality of metal vias each configured to connect adjacent metal layers of a plurality of metal layers. Aspects also include placing one or more cells on each metal layer of the IC and identifying a power demand associated with each of the one or more cells. Aspects further include updating the PDN, based on the power demand associated with each of the one or more cells, to replace at least two of the plurality of metal vias with a super via that is configured to connect non-adjacent metal layers of the plurality of metal layers.

• Power distribution network (PDN) for integrated circuits
• Metal vias connecting metal layers in the IC
• Placing cells on metal layers and identifying power demand
• Updating PDN to replace metal vias with super vias connecting non-adjacent metal layers

Potential Applications

The technology can be applied in the development of advanced integrated circuits for various electronic devices, such as smartphones, computers, and IoT devices.

Problems Solved

This technology helps optimize power distribution in integrated circuits, improving efficiency and performance while reducing power consumption and heat generation.

Benefits

- Enhanced power distribution efficiency - Improved overall performance of integrated circuits - Reduced power consumption and heat generation

Potential Commercial Applications

The technology can be utilized in the semiconductor industry for the production of high-performance integrated circuits, catering to the growing demand for faster and more efficient electronic devices.

Possible Prior Art

One possible prior art in this field is the use of traditional metal vias for connecting metal layers in integrated circuits. However, the innovation of super vias connecting non-adjacent metal layers is a novel approach to optimizing power distribution in ICs.

How does this technology impact the overall cost of manufacturing integrated circuits?

The article does not provide information on the cost implications of implementing super vias in the production of integrated circuits.

What are the potential challenges or limitations of using super vias in integrated circuits?

The article does not address any potential drawbacks or challenges that may arise from the implementation of super vias in integrated circuits.

Original Abstract Submitted

Embodiments include super via placement in the development of an integrated circuit. Aspects of the invention include obtaining a power distribution network for the integrated circuit (IC) IC, wherein the PDN includes a plurality of metal vias each configured to connect adjacent metal layers of a plurality of metal layers. Aspects also include placing one or more cells on each metal layer of the IC and identifying a power demand associated with each of the one or more cells. Aspects further include updating the PDN, based on the power demand associated with each of the one or more cells, to replace at least two of the plurality of metal vias with a super via that is configured to connect non-adjacent metal layers of the plurality of metal layers.