17932269. Qubit and Readout Overlap Optimization via Dipole Orientation simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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Qubit and Readout Overlap Optimization via Dipole Orientation

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Thomas George Mcconkey of Long Island City NY (US)

April Carniol of Ossining NY (US)

Srikanth Srinivasan of Mount Kisco NY (US)

Joseph Robert Suttle of Chappaqua NY (US)

Qubit and Readout Overlap Optimization via Dipole Orientation - A simplified explanation of the abstract

This abstract first appeared for US patent application 17932269 titled 'Qubit and Readout Overlap Optimization via Dipole Orientation

Simplified Explanation

The patent application describes a device that integrates circuit components for a qubit and a readout resonator, with overlapping footprints that are oriented based on their electric dipoles.

  • The device includes a first set of circuit components for a qubit.
  • It also includes a second set of circuit components for a readout resonator.
  • The footprints of these components overlap.
  • The orientation of the footprints is determined by the electric dipoles of the components.

Potential Applications

This technology could be applied in quantum computing, quantum communication, and quantum sensing.

Problems Solved

This innovation solves the challenge of integrating qubit and readout resonator components efficiently in a single device.

Benefits

The device offers a compact and integrated solution for qubit and readout resonator functionalities, potentially leading to improved performance and scalability in quantum systems.

Potential Commercial Applications

  • "Enhancing Quantum Computing Performance with Integrated Qubit and Readout Resonator Device


Original Abstract Submitted

A device includes a first set of circuit components implementing a qubit and a second set of circuit components implementing a readout resonator for reading out a state of the qubit. A first footprint of the first set of circuit components overlaps a second footprint of the second set of circuit components. The first footprint is oriented relative to the second footprint based on a first electric dipole of the first set of circuit components and a second electric dipole of the second set of circuit components.