17899117. Haptic Structure for Providing Haptic Outputs at an Electronic Device simplified abstract (Apple Inc.)

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Haptic Structure for Providing Haptic Outputs at an Electronic Device

Organization Name

Apple Inc.

Inventor(s)

Alex J. Lehmann of Sunnyvale CA (US)

Joonas I. Ponkala of San Jose CA (US)

Keith J. Hendren of San Francisco CA (US)

Xian Wang of San Mateo CA (US)

Yu-Lin Kao of Livermore CA (US)

Kevin C. Armendariz of San Francisco CA (US)

Haptic Structure for Providing Haptic Outputs at an Electronic Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 17899117 titled 'Haptic Structure for Providing Haptic Outputs at an Electronic Device

Simplified Explanation

The patent application describes an electronic device with a haptic module that is positioned below the device's cover. The haptic module includes a substrate, a spacer, and a piezoelectric element. The device also includes a sensor and a processing unit.

  • The electronic device has a cover and a haptic module positioned below it.
  • The haptic module consists of a substrate, a spacer, and a piezoelectric element.
  • The substrate is positioned below the cover and offset from it.
  • The spacer is placed between the substrate and the cover, connecting them.
  • The piezoelectric element is located on the substrate's surface and offset from the cover, creating a gap between them.
  • The device also includes a sensor that is connected to the cover and can detect user input.
  • A processing unit is linked to the piezoelectric element and can cause the cover to deflect in response to the sensor detecting input.

Potential Applications

This technology could be applied in various electronic devices, such as smartphones, tablets, gaming consoles, and wearable devices. It can enhance the user experience by providing haptic feedback in response to user input.

Problems Solved

The technology solves the problem of providing haptic feedback in electronic devices with a cover. By positioning the haptic module below the cover, it allows for a more seamless and integrated design while still providing tactile feedback to the user.

Benefits

  • Improved user experience: The haptic feedback provided by the device enhances the user's interaction and engagement with the device.
  • Seamless design: By positioning the haptic module below the cover, the device maintains a sleek and seamless design without compromising on functionality.
  • Versatility: The technology can be implemented in various electronic devices, making it adaptable to different user needs and preferences.


Original Abstract Submitted

Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device can also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.

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