17896638. SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Gwangjae Jeon of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17896638 titled 'SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes two insulating layers with recesses and a bonding surface. The recesses are spaced apart from pads and overlap to create an air gap. The bonding surfaces are formed by the insulating layers contacting each other on opposite sides of the air gap.
- The semiconductor package includes a first insulating layer with a recess and a first pad, and a second insulating layer with a recess and a second pad.
- The recesses in the two insulating layers are spaced apart from the respective pads.
- The second recess overlaps with at least a portion of the first recess, creating an air gap.
- The first and second insulating layers form a first bonding surface on one side of the air gap, adjacent to the first and second pads.
- The first and second insulating layers also form a second bonding surface on the opposite side of the air gap.
Potential Applications
- This semiconductor package can be used in various electronic devices, such as smartphones, computers, and IoT devices.
- It can be applied in integrated circuits, microprocessors, and other semiconductor components.
Problems Solved
- The air gap created by the overlapping recesses helps in reducing heat transfer between the pads and the insulating layers.
- It provides improved electrical insulation and protection for the semiconductor components.
Benefits
- The air gap helps in dissipating heat more efficiently, preventing overheating of the semiconductor components.
- The insulating layers and bonding surfaces provide enhanced electrical insulation and protection.
- The design of the semiconductor package allows for compact and efficient integration of semiconductor components.
Original Abstract Submitted
A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a portion of the first recess in a second direction, perpendicular to the first direction, to provide an air gap together with the first recess. The semiconductor package further includes a first bonding surface defined by the first and second insulating layers contacting each other on one side of the air gap, adjacent to the first and second pads, and a second bonding surface defined by the first and second insulating layers contacting each other on another side of the air gap, opposite to the one side.
