View source for 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Chia-Yu Ling of Hsinchu City (TW)|Chia-Yu Ling of Hsinchu City (TW)]][[Category:Chia-Yu Ling of Hsinchu City (TW)]]

[[:Category:Hsin-Yu Lai of Hsinchu (TW)|Hsin-Yu Lai of Hsinchu (TW)]][[Category:Hsin-Yu Lai of Hsinchu (TW)]]

[[:Category:Katherine H Chiang of New Taipei City (TW)|Katherine H Chiang of New Taipei City (TW)]][[Category:Katherine H Chiang of New Taipei City (TW)]]

[[:Category:Chung-Te Lin of Tainan City (TW)|Chung-Te Lin of Tainan City (TW)]][[Category:Chung-Te Lin of Tainan City (TW)]]

==INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17896083 titled 'INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE

==Simplified Explanation==

The abstract describes an interposer substrate with a bridge device, memory, and through substrate via.

* Interposer substrate with:
  * Substrate
  * Bridge device in the substrate
  * Memory in the substrate beside the bridge device
  * Through substrate via in the substrate beside the bridge device and memory

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### Potential Applications
* Advanced packaging technology in semiconductor industry
* High-performance computing applications
* Data storage devices

### Problems Solved
* Improved signal transmission between components
* Enhanced memory integration in package structures
* Increased data processing speed and efficiency

### Benefits
* Higher performance and reliability in electronic devices
* More compact and efficient package structures
* Improved overall system functionality and speed


==Original Abstract Submitted==

Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the bridge device and a through substrate via in the substrate and beside the bridge device and the memory.



[[Category:H01L23/538]]
[[Category:H01L21/48]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:H01L25/16]]