17894063. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17894063 titled 'SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Simplified Explanation
The semiconductor device assembly described in the patent application includes a semiconductor die and a substrate with multiple conductive layers and solder mask layers.
- The substrate has a primary conductive layer with a first surface and a first solder mask layer.
- The substrate also has a secondary conductive layer with a second surface and a second solder mask layer.
- An inner conductive layer is positioned between the primary and secondary layers, with a bond pad at the end of an opening that extends through the layers.
- Attaching a solder ball to the bond pad of the inner layer helps reduce standoff height.
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
Problems Solved
- Reducing standoff height in semiconductor device assembly
- Improving reliability of solder connections
Benefits
- Enhanced performance of semiconductor devices
- Increased durability of electronic components
Original Abstract Submitted
A semiconductor device assembly includes a semiconductor die and a substrate coupled to the semiconductor die. The substrate includes a primary conductive layer including a first surface of the substrate and a first solder mask layer coupled to the first surface. The substrate also includes a secondary conductive layer including a second surface of the substrate and a second solder mask layer coupled to the second surface. The substrate further includes an inner conductive layer positioned between the primary layer and the secondary layer, where the inner layer includes a bond pad positioned at the end of an opening that extends from the second solder mask layer through the secondary layer to the bond pad of the inner layer. By attaching a solder ball to the bond pad of the inner layer, standoff height is reduced.
