17888889. ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)

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ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY

Organization Name

SAMSUNG ELECTRONICS CO.,LTD.

Inventor(s)

Hyungwoo Lee of Suwon-si (KR)

Jongchun Wee of Suwon-si (KR)

Byounguk Yoon of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 17888889 titled 'ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY

Simplified Explanation

The patent application describes a sound component assembly for an electronic device with a sound module. It includes a sealing portion that surrounds a portion of the sound passage and contacts the printed circuit board (PCB) with the sound module. There is also a cover portion facing the PCB outside the sealing portion.

  • The sealing portion is made of a first material, while the cover portion is made of a second material with a higher hardness.
  • The sound component assembly is designed to provide a seal around the sound passage and protect the PCB and sound module.
  • The use of different materials with varying hardness helps to ensure the durability and longevity of the assembly.

Potential Applications

  • This technology can be applied in various electronic devices that require sound components, such as smartphones, tablets, laptops, and audio devices.
  • It can be used in industrial equipment, automotive systems, and any other devices that require sound modules and protection.

Problems Solved

  • The sound component assembly solves the problem of protecting the PCB and sound module from external elements, such as dust, moisture, and physical damage.
  • It also addresses the need for a reliable seal around the sound passage to maintain sound quality and prevent any interference.

Benefits

  • The use of a sealing portion and cover portion ensures a secure and effective seal, protecting the PCB and sound module from potential damage.
  • The different materials with varying hardness provide enhanced durability and longevity to the assembly.
  • The sound component assembly helps to maintain the sound quality and performance of the electronic device.


Original Abstract Submitted

A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.

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