17886208. SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
Organization Name
Inventor(s)
Seolyoung Choi of Yongin-si (KR)
Kyoungjun Kim of Yongin-si (KR)
SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17886208 titled 'SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
Simplified Explanation
The patent application describes a semiconductor light emitting device package that includes a ceramic substrate, a light emitting diode chip, metal patterns, an adhesive pattern, and a protector.
- The ceramic substrate has electrode structures and is used as a base for the device package.
- The light emitting diode chip is mounted on the ceramic substrate and emits ultraviolet light.
- Metal patterns are placed on the ceramic substrate, away from the electrode structures.
- An adhesive pattern is positioned between the metal patterns and has side surfaces in contact with the metal patterns and an upper surface below the light emitting diode chip.
- A protector is attached to the ceramic substrate using the adhesive pattern, creating a cavity around the light emitting diode chip.
Potential Applications
- Ultraviolet light sources for various applications such as sterilization, water purification, and curing processes.
- Semiconductor devices used in medical, industrial, and consumer electronics.
Problems Solved
- Provides a protective cavity around the light emitting diode chip, preventing damage and enhancing its lifespan.
- Ensures proper electrical connection between the chip and the electrode structures.
- Offers a reliable and efficient packaging solution for semiconductor light emitting devices.
Benefits
- Enhanced durability and longevity of the light emitting diode chip.
- Improved performance and reliability of the semiconductor light emitting device.
- Cost-effective and efficient packaging solution for ultraviolet light sources.
Original Abstract Submitted
A semiconductor light emitting device package includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; metal patterns disposed on the ceramic substrate to be spaced apart from the first and second electrode structures; an adhesive pattern disposed on the ceramic substrate between the adjacent metal patterns, the adhesive pattern having both side surfaces in contact with one side surface of the metal patterns and an upper surface positioned on a level below that of a lower surface of the light emitting diode chip; and a protector attached to the ceramic substrate by the adhesive pattern, the protector providing a cavity surrounding the light emitting diode chip.
