17882169. STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE
Organization Name
Inventor(s)
Kyung-Eun Byun of Seongnam-si (KR)
Keunwook Shin of Yongin-si (KR)
STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17882169 titled 'STACKED STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE STACKED STRUCTURE
Simplified Explanation
The abstract describes a stacked structure consisting of multiple layers of different materials, including a two-dimensional material layer with holes that expose the layer beneath it. The layers are connected through these holes.
- The stacked structure includes multiple layers of different materials.
- The two-dimensional material layer has holes that expose the layer beneath it.
- The layers are connected through these holes.
Potential Applications
- Electronics and semiconductor devices
- Optoelectronics and photonics
- Energy storage and conversion systems
Problems Solved
- Enhances the integration and performance of stacked structures
- Provides a method for connecting different material layers effectively
Benefits
- Improved functionality and performance of stacked structures
- Enhanced electrical and optical properties
- Increased efficiency and reliability of devices
Original Abstract Submitted
A stacked structure may include a first material layer, a two-dimensional material layer on the first material layer, and a second material layer on the two-dimensional material layer. The two-dimensional material layer may include a plurality of holes that each expose a portion of the first material layer. The second material layer may be coupled to the first material layer through the plurality of holes.
