17881367. WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME
Organization Name
Inventor(s)
WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17881367 titled 'WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME
Simplified Explanation
The wafer inspection apparatus described in the patent application includes several components: a stage, an optical apparatus, a focus adjusting unit, and an image processor.
- The stage is where the wafer is placed for inspection.
- The optical apparatus aligns the wafer on the stage and generates an optical intensity image with an optical intensity profile.
- The focus adjusting unit ensures that the light incident on the wafer is in-focus.
- The image processor integrates the optical intensity image with vertical level data to create and analyze a three-dimensional (3D) image.
Potential applications of this technology:
- Semiconductor manufacturing: This apparatus can be used to inspect wafers during the manufacturing process, ensuring the quality and accuracy of the semiconductor devices being produced.
- Quality control: The 3D image generated by the apparatus can be used for detailed inspection and analysis of various products, such as electronic components, optical devices, and microelectromechanical systems (MEMS).
- Research and development: The apparatus can aid in the development of new materials and technologies by providing precise and detailed imaging capabilities.
Problems solved by this technology:
- Accurate alignment: The optical apparatus and focus adjusting unit ensure that the wafer is properly aligned and in-focus, allowing for accurate inspection and analysis.
- Detailed imaging: The integration of the optical intensity image with vertical level data enables the generation of a 3D image, providing a more comprehensive view of the wafer and its features.
Benefits of this technology:
- Improved inspection accuracy: The combination of precise alignment and in-focus lighting results in more accurate inspection and analysis of wafers and other products.
- Enhanced imaging capabilities: The 3D image generated by the apparatus provides a more detailed and comprehensive view, allowing for better identification and analysis of defects or irregularities.
- Time and cost savings: The integration of multiple functions into a single apparatus streamlines the inspection process, reducing the time and cost required for quality control and research activities.
Original Abstract Submitted
A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.
