17878825. INTEGRATED CIRCUIT CELL WITH DUAL ROW, BACK-TO-BACK, TRANSISTOR BODY TIES simplified abstract (QUALCOMM Incorporated)

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INTEGRATED CIRCUIT CELL WITH DUAL ROW, BACK-TO-BACK, TRANSISTOR BODY TIES

Organization Name

QUALCOMM Incorporated

Inventor(s)

Manjanaika Chandranaika of Bangalore (IN)

Parissa Najdesamii of San Diego CA (US)

Kamesh Medisetti of Bangalore (IN)

Iranagouda Shivanagouda Naganagoudra of Bengaluru (IN)

INTEGRATED CIRCUIT CELL WITH DUAL ROW, BACK-TO-BACK, TRANSISTOR BODY TIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17878825 titled 'INTEGRATED CIRCUIT CELL WITH DUAL ROW, BACK-TO-BACK, TRANSISTOR BODY TIES

Simplified Explanation

The abstract of the patent application describes an integrated circuit (IC) that includes two rows of cells, each containing a set of complementary metal oxide semiconductor (CMOS) signal processing cells with diffusion regions. These diffusion regions are electrically coupled to a first voltage rail through a first body tie.

  • The patent application is for an integrated circuit (IC) design.
  • The IC includes two rows of cells, each containing CMOS signal processing cells with diffusion regions.
  • A first body tie is used to electrically couple the first voltage rail to the diffusion regions in both rows of cells.

Potential Applications:

  • This technology can be used in various electronic devices that require signal processing, such as smartphones, tablets, and computers.
  • It can be applied in audio and video processing circuits, communication systems, and data processing units.

Problems Solved:

  • The integration of CMOS signal processing cells with diffusion regions allows for efficient signal processing within the IC.
  • The use of a first body tie ensures a stable and reliable connection between the first voltage rail and the diffusion regions.

Benefits:

  • The IC design provides improved signal processing capabilities.
  • The integration of CMOS signal processing cells allows for compact and efficient circuitry.
  • The use of a first body tie ensures a reliable electrical connection, reducing the risk of signal loss or interference.


Original Abstract Submitted

An integrated circuit (IC), including a first row of cells including a first set of one or more complementary metal oxide semiconductor (CMOS) signal processing cells including a first diffusion region; a second row of cells including a second set of one or more CMOS signal processing cells including a second diffusion region; and a first body tie electrically coupling a first voltage rail to the first and second diffusion regions.

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