17878671. Adapter And System For Thermal Management Of Computing Systems simplified abstract (GOOGLE LLC)

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Adapter And System For Thermal Management Of Computing Systems

Organization Name

GOOGLE LLC

Inventor(s)

Feini Zhang of Fremont CA (US)

Xu Zuo of Saratoga CA (US)

Michael Chi Kin Lau of Los Altos CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

Adapter And System For Thermal Management Of Computing Systems - A simplified explanation of the abstract

This abstract first appeared for US patent application 17878671 titled 'Adapter And System For Thermal Management Of Computing Systems

Simplified Explanation

The abstract describes an adapter that connects a liquid cooling loop subassembly of a computing system to a device rack manifold. The adapter includes a main body, a first connector, a second connector, and a flow control device. The first connector attaches the adapter to the liquid cooling loop subassembly, while the second connector attaches it to the device rack manifold. The flow control device regulates the flow rate of liquid coolant through the subassembly. The adapter can be used in a rack assembly or multi-rack assembly to manage the thermal conditions of multiple computing systems with cooling loop subassemblies.

  • The adapter connects a liquid cooling loop subassembly to a device rack manifold.
  • It includes a main body, first and second connectors, and a flow control device.
  • The first connector attaches the adapter to the liquid cooling loop subassembly.
  • The second connector attaches the adapter to the device rack manifold.
  • The flow control device regulates the flow rate of liquid coolant.
  • The adapter can be used in a rack assembly or multi-rack assembly.
  • It enables thermal management of multiple computing systems with cooling loop subassemblies.

Potential Applications:

  • Data centers and server rooms where multiple computing systems require efficient liquid cooling.
  • High-performance computing environments that generate significant heat and require effective cooling solutions.
  • Industrial applications where precise temperature control is necessary for equipment or processes.

Problems Solved:

  • Efficiently coupling a liquid cooling loop subassembly to a device rack manifold.
  • Regulating the flow rate of liquid coolant through the cooling loop subassembly.
  • Achieving thermal management of multiple computing systems in a rack or multi-rack assembly.

Benefits:

  • Improved cooling efficiency and thermal management of computing systems.
  • Enhanced performance and reliability by maintaining optimal operating temperatures.
  • Flexibility to adapt to different rack configurations and liquid cooling loop subassemblies.
  • Potential energy savings by optimizing the flow rate of liquid coolant.


Original Abstract Submitted

An adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold includes a main body, a first connector disposed on the main body, a second connector disposed on the main body, and a flow control device disposed between the first and second connectors. The first connector couples the adapter to a coupling of the liquid cooling loop subassembly. The second connector couples the adapter to the device rack manifold. The flow control device may be configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly. The adapter may be further incorporated into a rack assembly or multi-rack assembly to achieve thermal management of multiple computing systems with cooling loop subassemblies.

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