17876709. THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE simplified abstract (Dell Products L.P.)

THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE

Organization Name

Dell Products L.P.

Inventor(s)

Travis C. North of Cedar Park TX (US)

Enoch Chen of Taipei (TW)

Deeder M. Aurongzeb of Austin TX (US)

THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17876709 titled 'THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE

Simplified Explanation

The abstract describes a thermal management technique for reducing heat transferred to a user while maintaining the mechanical strength of an outer housing of an information handling system. The technique involves the use of a thermal management structure, specifically a porous layer, adjacent to the inner lateral surface of the outer housing. This porous layer, which can be made of a metal or metal alloy, such as a honeycomb structure or metal foam, increases thermal resistance in a direction orthogonal to the inner lateral surface.

• The thermal management technique reduces heat transferred to the user.
• The mechanical strength of the outer housing is maintained.
• A porous layer is used as a thermal management structure.
• The porous layer increases thermal resistance in a specific direction.
• The porous layer can be made of a metal or metal alloy.
• The metal or metal alloy can be in the form of a honeycomb structure or metal foam.

Potential Applications:

• Information handling systems, such as computers, laptops, or servers, can benefit from this thermal management technique.
• Electronic devices with outer housings that require heat dissipation can utilize this technique.

Problems Solved:

• Heat transferred to the user can be uncomfortable or even harmful, so reducing heat is important for user comfort and safety.
• Maintaining the mechanical strength of the outer housing is crucial to protect the internal components of the information handling system.

Benefits:

• Improved user comfort by reducing heat transferred to the user.
• Enhanced safety by preventing excessive heat exposure.
• Protection of internal components by maintaining the mechanical strength of the outer housing.
• Potential for increased lifespan and reliability of the information handling system.

Original Abstract Submitted

A thermal management technique reduces heat transferred to a user while maintaining mechanical strength of an outer housing of an information handling system. In at least one embodiment, an information handling system includes an outer housing and a thermal management structure adjacent to an inner lateral surface of the outer housing. The thermal management structure includes a porous layer configured to increase thermal resistance in a first direction orthogonal to the inner lateral surface of the outer housing. The porous layer may include a honeycomb structure formed from a metal or a metal alloy. The porous layer may include a metal foam.