17874527. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Junghyun Lee of Hwaseong-si (KR)
Junghoon Kang of Anyang-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17874527 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a method for manufacturing a semiconductor package. Here is a simplified explanation of the abstract:
- The method involves creating a pad pattern on a semiconductor chip, which includes a metal film.
- An insulating layer is then formed over the pad pattern using an organic insulating material.
- Laser processing is performed on the insulating layer to create an opening that exposes the surface of the metal film in the pad pattern.
- During the laser processing, a specific region of the metal film is plastically deformed.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Efficiently creating openings in the insulating layer to expose the metal film without damaging the semiconductor chip or the metal film itself.
- Ensuring proper electrical connectivity between the metal film and external components.
Benefits of this technology:
- Precise and controlled laser processing allows for accurate creation of openings in the insulating layer.
- Plastically deforming the metal film in a specific region helps improve the electrical connectivity and reliability of the semiconductor package.
Original Abstract Submitted
A method for manufacturing a semiconductor package includes forming a pad pattern including a metal film on a semiconductor chip; forming an insulating layer covering the pad pattern and including an organic insulating material; and forming an opening exposing a surface of the metal film of the pad pattern by performing laser processing on the insulating layer, wherein, in forming the opening, a region to be plastically deformed on the metal film by the laser processing is formed.
