17872999. LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME simplified abstract (CANON KABUSHIKI KAISHA)
Contents
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Souta Takeuchi of Kanagawa (JP)
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17872999 titled 'LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a liquid ejection head that is highly reliable and includes a substrate made of silicon, an ejection port forming member, and a bonded member. The substrate has a through flow path for supplying liquid to the ejection port. A protective film made of a metal oxide is formed on the inner surface of the through flow path, and a protective film made of a silicon compound is formed on the second surface of the substrate.
- The liquid ejection head is made of a silicon substrate and includes an ejection port for ejecting liquid.
- A through flow path is formed in the substrate to supply liquid to the ejection port.
- The inner surface of the through flow path is coated with a protective film made of a metal oxide.
- The second surface of the substrate is coated with a protective film made of a silicon compound.
- The ejection port forming member and bonded member are securely attached to the substrate.
Potential applications of this technology:
- Inkjet printers
- 3D printers
- Industrial printing systems
- Bioprinting
Problems solved by this technology:
- Ensures reliable and consistent liquid ejection
- Protects the substrate and flow path from corrosion and damage
- Improves the longevity and performance of the liquid ejection head
Benefits of this technology:
- Highly reliable liquid ejection
- Improved durability and longevity
- Enhanced print quality and accuracy
- Reduced maintenance and downtime
Original Abstract Submitted
A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.
