17870977. ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE
Organization Name
Inventor(s)
Minsu Jung of Gyeonggi-do (KR)
Kwonho Son of Gyeonggi-do (KR)
ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17870977 titled 'ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE
Simplified Explanation
The abstract describes an electronic device that includes a conductive and non-conductive housing, substrates, electronic components, contact members, and a support member.
- The electronic device has a housing with both conductive and non-conductive portions.
- It includes a first substrate on which electronic components are placed.
- A second substrate is electrically connected to the first substrate and has two surfaces facing opposite directions.
- Contact members are positioned between the first surface of the second substrate and the conductive portion of the housing.
- A support member is placed between the first surface of the second substrate and the non-conductive portion of the housing.
Potential applications of this technology:
- Consumer electronics such as smartphones, tablets, or laptops.
- Industrial equipment and machinery.
- Medical devices and equipment.
- Automotive electronics.
Problems solved by this technology:
- Provides a structure that allows for efficient electrical coupling between substrates and the housing.
- Helps in dissipating heat generated by electronic components.
- Reduces the risk of electrical interference or short circuits.
Benefits of this technology:
- Improved electrical performance and reliability of the electronic device.
- Enhanced thermal management capabilities.
- Reduced risk of damage to electronic components.
- Simplified manufacturing and assembly processes.
Original Abstract Submitted
According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.
