17863843. INSULATION STRUCTURE, INSULATED PIPING DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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INSULATION STRUCTURE, INSULATED PIPING DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Dongwan Kim of Suwon-si (KR)

Jeong-Hyun Kim of Pyeongtaek-si (KR)

Seung-Hyeok An of Hwaseong-si (KR)

Saya Lee of Osan-si (KR)

Yoong Chung of Suwon-si (KR)

Jiho Jeon of Yeosu-si (KR)

Yongjun Cho of Pyeongtaek-si (KR)

Injun Choi of Hwaseong-si (KR)

INSULATION STRUCTURE, INSULATED PIPING DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17863843 titled 'INSULATION STRUCTURE, INSULATED PIPING DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The patent application describes insulation structures for pipes, insulated piping devices, and methods of fabrication. Here is a simplified explanation of the abstract:

  • The insulation structure consists of three layers on the outer surface of a pipe.
  • The first insulation layer is closest to the pipe, followed by the second insulation layer, and finally the third insulation layer.
  • The second insulation layer is thicker than both the first and third insulation layers.
  • The second insulation layer is made of a porous foam material, which is different from the materials used in the other two layers.

Potential Applications:

  • Insulation for pipes used in various industries such as oil and gas, chemical, and HVAC systems.
  • Thermal insulation for plumbing systems in residential and commercial buildings.
  • Insulation for underground piping systems.

Problems Solved:

  • Provides improved insulation for pipes, reducing heat loss or gain.
  • Prevents condensation on the outer surface of pipes, protecting them from moisture damage.
  • Enhances energy efficiency by minimizing heat transfer in piping systems.

Benefits:

  • Increased thermal efficiency due to the layered insulation structure.
  • Enhanced durability and protection for pipes against external elements.
  • Improved energy efficiency, leading to potential cost savings.
  • Versatile application in different industries and environments.


Original Abstract Submitted

Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.