17858921. COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION simplified abstract (Samsung Electronics Co., Ltd.)

COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Minyoung Lee of Suwon-si (KR)

Hyungrang Moon of Suwon-si (KR)

Ryunmin Heo of Suwon-si (KR)

Minsoo Kim of Suwon-si (KR)

Youngkwon Kim of Suwon-si (KR)

Jaehyun Kim of Suwon-si (KR)

Changsoo Woo of Suwon-si (KR)

Jung Min Choi of Suwon-si (KR)

Moohyun Koh of Hwaseong-si (KR)

Jungah Kim of Hwaseong-si (KR)

Sungan Do of Hwaseong-si (KR)

Sang Won Bae of Suwon-si (KR)

Hoon Han of Hwaseong-si (KR)

SukKoo Hong of Hwaseong-si (KR)

COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17858921 titled 'COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION

Simplified Explanation

The abstract describes a composition and method for removing edge beads from a metal-containing resist used in forming patterns. The composition includes an organic solvent and a heptagonal ring compound with hydroxyl groups and double bonds in the ring.

• The composition is used to remove edge beads from a metal-containing resist.
• The composition includes an organic solvent and a heptagonal ring compound.
• The heptagonal ring compound has hydroxyl groups and double bonds in the ring.
• The method involves applying the composition to the resist to remove edge beads.
• The composition effectively removes edge beads, improving pattern formation.

Potential Applications

• Semiconductor manufacturing
• Microelectronics fabrication
• Photolithography processes

Problems Solved

• Edge beads can interfere with pattern formation in metal-containing resists.
• Existing methods for removing edge beads may not be effective or efficient.

Benefits

• Improved pattern formation by removing edge beads.
• Enhanced quality and precision in semiconductor and microelectronics manufacturing.
• Increased efficiency and cost-effectiveness in photolithography processes.

Original Abstract Submitted

A composition for removing edge beads from a metal-containing resist, and a method of forming patterns including step of removing edge beads using the same are provided. The composition for removing edge beads from a metal-containing resist includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxyl group (—OH). The heptagonal ring compound has at least two double bonds in the ring.